About ETAI 2024

The 3^rd International Conference on Electronics Technology and Artificial Intelligence

As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. Such endeavors are making new contributions to the globalization and creating a community of shared future.

The 3^rd International Conference on Electronics Technology and Artificial Intelligence (ETAI 2024) is scheduled to be held in Guangzhou, China from June 28 to 30, 2024. ETAI 2023 has been successfully held in August 19, 2023 in Changsha, China. This conference takes "bringing together global wisdom in scientific innovation to promote high-quality development" as the theme and focuses on cutting-edge research fields including electronics technology and artificial intelligence. This conference aims to boost development of the Greater Bay Area, expand channels of international academic exchange in science and technology, build a sharing platform of academic resources, promote scientific innovation on the global scale, strengthen academic cooperation between China and the outside world, enhance development of new energy and materials and IT, AI, and biomedicine industries. It also aims to encourage exchange of information on frontiers of research in different areas, connect the most advanced academic resources in China and the world, turn research results into industrial solutions, and bring together talents, technologies, and capital to boost development.

SUBMISSION & PUBLICATION

 Please send the full paper(word+pdf) to Submission System : 

Submission System (For author from China)

Submission System (For author from overseas)

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Submission

 All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ETAI 2024 will be published in the conference Proceedings, and it will be submitted to EI Compendex and Scopus for indexing.

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Publication